| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate which can prevent a mounted component from falling off by assuring an adhesion space between an insulated slit and lands on the opposite sides thereof. SOLUTION: In the wiring substrate P where lands 1 and 1 for bonding the terminal 10a of a mounted component 10 are formed oppositely on the surface, an insulated slit 2 is provided between the opposing lands 1 and 1 in the direction intersecting a line L connecting both lands 1 and 1 obliquely. Between the insulated slit 2 and both lands 1 and 1, substantially triangular and relatively large adhesion spaces S and S for applying adhesive are assured, and the mounted component 10 is bonded by the adhesive applied to adhesion spaces S and S thus preventing the mounted component from falling off. COPYRIGHT: (C)2008,JPO&INPIT
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