| 摘要 |
<p>A microchip in which any inter-substrate gap in the vicinity of aperture provided therein can be infilled so as to prevent leakage of a reagent, etc. The microchip comprises microchip substrate (10) and microchip substrate (14). The microchip substrate (10) is furnished with groovelike microchannel (11) and a through-hole. The microchip is produced by joining the microchip substrate (10)with the microchip substrate (14). Aperture (12) is connected to the microchannel (11), and through the aperture (12), there are carried out, for example, introduction of a reagent, etc. and discharge of a reagent, etc. The aperture (12) on its internal surface is provided with dielectric film (13). A SiO<SUB>2</SUB> film or TiO<SUB>2</SUB> film is used as the dielectric film (13).</p> |
