STACKABLE MICROPACKAGES AND STACKED MODULES

摘要

The present invention provides a system and method for devising stackable assemblies (70) that may be then stacked to create a stacked circuit module (50). One or more integrated circuit (IC) die (12) are disposed on one or more sides of a redistribution substrate (20) that is preferably flexible circuitry. In some preferred embodiments, the die (12) and redistribution substrate (20) are bonded together and wire-bond (33) connected. Two or more stackable assemblies (70) are interconnected through frame members (30) to create low profile high density stacked circuit modules (50).