METHOD OF MANUFACTURING INTEGRATED CIRCUIT PACKAGE AND INTEGRATED CIRCUIT PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide an integrated circuit package such as BGA packages for mounting an integrated circuit chip.

SOLUTION: The integrated circuit package has a board including a hollow with a low conductive level exposed in the package and hence a connection can be formed between an integrated circuit chip and an underlying conductive level to reduce the number of through-holes formed in the board. As a result, added signal line interconnections can be contained in a board circuit package and/or the integrated circuit chip can be made compact, thereby improving the electric performance. In a board containing a plurality of bonding hierarchical layers, the wire-to-wire length is longer and hence a wire bonding process and a later sealing process can be made easily.

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