MODULE FOR TACTILE SENSOR AND METHOD FOR PACKAGING TACTILE SENSOR

摘要

The invention provides a tactile sensor module that enables adjustment of the density of sensing elements and adjustment of mounting regions to be carried out in a straightforward manner with one type of module that is highly adaptive to complex curved surfaces. A tactile sensor module comprises a flexible substrate having one or a plurality of strips, a plurality of sensing elements arranged at the one or plurality of strips of the flexible substrate, one or more communication terminals provided at the flexible substrate; and at least one electronic circuit section provided at the flexible substrate having communication functions. At least one of the strips comprises a foldable region and/or a cuttable region.