| 摘要 |
A surface mountable device[40] having a circuit device[58] and a base section[59]. The circuit device[58] includes top and bottom layers having a top contact and a bottom contact, respectively. The base section[59] includes a substrate[48] having a top base surface and a bottom base surface. The top base surface includes a top electrode bonded[53] to the bottom contact[44], and the bottom base surface includes first and second bottom electrodes[51, 52] that are electrically isolated from one another. The top electrode is connected to the first bottom electrode, and the second bottom electrode is connected to the top contact by a vertical conductor [45]. An insulating layer[57] is bonded to a surface of the circuit device and covers a portion of a vertical surface of the bottom layer. The vertical conductor includes a layer of metal bonded to the insulating layer. |
