ELECTRONIC APPARATUS COOLING DEVICE AND COOLING METHOD

摘要

It is possible to provide a device and a method for cooling an electronic apparatus, in which a part can be mounted nearer to an LSI, and which can shorten the wire length and improve the signal transmission speed. A single liquid cooling unit is thermally connected to a single heat generating body. The plane as an area where a plurality of fins are arranged has substantially the same shape and the same area as the thermal connection plane for the single liquid cooling unit of the single heating body. Accordingly, it is possible to reduce the size of the cooling device and mount it in the vicinity of an LSI, for example, as the electronic apparatus. This shortens the wire length and improves the signal transmission speed.