| 摘要 |
A semiconductor package and a method for manufacturing the same are provided to make thin the thickness of the semiconductor package by inserting a semiconductor chip in an opening part of a substrate. A semiconductor package comprises a semiconductor chip(100) having bonding pads(101), a lead frame(110), a substrate(200), a conductive wire(120) for connecting leads to the bonding pads, a molding structure(130), and an outer contact terminal(140) located at backside of the substrate for connecting the contact pads. The lead frame further includes a die pad(112) for mounting the semiconductor chip and a plurality of leads(114) located at both sides of the die pad. The substrate further includes an opening part for inserting the die pad, and contact pads(220) connected to the leads. |
