| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heatsink substrate with a fine concavity and convexity on at least one surface of a heatsink member having a concavity and convexity on the surface filled with a member excellent in the heat conductivity. <P>SOLUTION: The heatsink plate (1) comprises the heatsink members (6, 7) having concavities and convexities on the surface and the heat conductive sheet (8) jointed to the concavities and the convexities. The heat conductive sheet (8) comprises a thermosetting resin (2), a heat conductive microscopic filler (3) having a particle diameter of not more than 1/10 to the concavities and convexities, and inorganic fillers (4, 5) having average particle sizes of not less than 3 μm nor more than 100 μm and a heat conductivity and an insulation property. <P>COPYRIGHT: (C)2008,JPO&INPIT |
