Radio frequency module package structure has substrate with die receiving perforations, conducting contacting connections and metallic perforations, where conducting disk is fixed under surface of substrate

摘要

The radio frequency module package structure has a substrate (2) with die-receiving perforations, conducting contacting connections and metallic perforations. A conducting disk is fixed under a surface of the substrate, where multiple dies (6) are arranged in the die-receiving perforations and on the conducting disk. A dielectric multi-pack structure is stacked on multiple dies and substrates, where multiple redistribution layers (14) are arranged within the dielectric multi-pack structure and coupled with the dies. An upper conducting layer is formed on the dielectric multi-pack structure. An independent claim is also included for a method for producing a semiconductor package.