| 摘要 |
A method for transporting large quantities of convoluted, multiply bent, irregularly shaped, pieces of scrap metal from the location where they are produced to a remote location where the metal may be recycled, comprises flattening and temporarily binding together a batch of such pieces into an assembled wafer. The binding is produced by applying a compressive force of sufficient intensity to temporarily interconnect the pieces together but of insufficient intensity to interconnect the piece tightly enough to resist disassembly of the wafer upon impacting the assembled wafer. After the formation of a wafer comprising the interconnected numerous pieces, the wafer is transported to a remote site for recycling the metal. At such remote site, the wafer is disassembled into its constituent pieces by applying an impact to the wafer of sufficient intensity to cause the disengagement of the pieces for disassembling the wafer. The impact may be applied by dropping the wafers from a predetermined height above a ground surface for gravity falling and striking against the surface. The force of the impact may be assisted by vibrating the wafer when it is raised above the surface.
|
