| 摘要 |
A semiconductor chip for a TAP(tape automated bonding) package is provided to increase misalignment tolerance of a chip pad and a lead caused by deformation of a circuit board by using chip pads with mutually different widths. Inner chip pads(222,223) are disposed on a semiconductor substrate(210), one-dimensionally arranged on a first column parallel with a first side of the semiconductor substrate. Outermost chip pads(221) are disposed on the semiconductor substrate, one-dimensionally arranged on a second column between the first column and the first side. When seen from a vertical cross section parallel with the first side, the inner chip pads have a greater width than that of the outermost chip pads. When seen from a lateral view facing the first side, the outermost chip pads can be positioned between the inner chip pads. |
