POLISHING PAD CONDITIONER IN CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

A polishing pad conditioner of a CMP apparatus is provided to obtain CoO(Cost of Ownership) margin and to improve uniformity of the polishing pad by conditioning the polishing pad using a sonic generator. A polishing pad conditioner comprises a sonic generator(316), a holder(320), and a driving source(322). The sonic generator is polished to the polishing pad by a sound wave while reciprocating and rotating accordance with radius direction of the polishing pad. The holder of the sonic generator capable of moving up and down is supported to the sonic generator. The power for driving the holder is generated by the driving source.