| 摘要 |
<p>This invention provides a printed wiring board 39 comprising conductor circuits 31 for solder pad and a solder resist layer 38 formed on the conductor circuit 31 for solder pad, wherein the solder resist layer 38 is formed in opening portions 37, 36 to be provided with a solder body. In the printed wiring board 39 according to the invention, the conductor circuit 31 for solder pad has a roughened surface 32 treated with an etching solution containing copper(II) complex and organic acid, and the solder resist layer 38 is formed on the roughened surface 32. In the printed wiring board according to the invention, the adhesion property between fine wired conductor circuit and solder resist layer is enhanced, and the conductor circuit and the solder resist layer are strongly adhered to each other without peeling even in solder bump forming portions and bad continuity is not caused in the solder bump forming portion.</p> |
