发明名称 Double silicon-on-insulator (SOI) metal oxide semiconductor field effect transistor (MOSFET) structures
摘要 A SOI MOSFET structure having a reduced step height between the various semiconductor layers without adversely affecting the junction capacitance of the semiconductor device formed on the uppermost semiconductor layer as well as a method of fabricating the same are provided. The structure of the present invention includes an elevated device region having at least one semiconductor device located on a second semiconductor layer. The elevated device region further includes a source/drain junction that extends from the second semiconductor layer down to a first buried insulator layer that is located on an upper surface of the semiconductor substrate. The structure also includes a recessed device region having at least one semiconductor device located atop a first semiconductor layer which is located on an upper surface of the first buried insulator. An isolation region separates the elevated device region from the recessed device region.
申请公布号 US7393732(B2) 申请公布日期 2008.07.01
申请号 US20060351184 申请日期 2006.02.09
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 RIM KERN
分类号 H01L21/00;H01L21/84;H01L27/12;H01L29/04;H01L29/10;H01L29/786 主分类号 H01L21/00
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