| 摘要 |
A joined body in which two or more objects to be joined are integrated through a bonding material layer formed of a bonding material composition is provided to suppress deformation of the objects to be joined due to thermal distortion with the bonding material layer, hardly cause fracture of the bonding material layer due to stress, and obtain excellent thermal shock resistance. As a bonding material in which two or more objects to be joined are integrated through a bonding material layer(9) formed of a bonding material composition, a joined body(1) is characterized in that the bonding material composition comprises plate-type particles, non-plate type particles, and an inorganic adhesive as main components, and the bonding material layer has a Young's modulus of 3 GPa or more. The bonding material composition comprises, as the plate type particles, plate type particles having a Young's modulus of 100 GPa or more. The bonding material composition comprises, as the non-plate type particles, non-plate type particles having a Young's modulus of 100 GPa or more. The plate type particles are contained in the bonding material composition at the ratio of 1 to 60% by mass relative to the total amount of the main components. The plate type particles have an aspect ratio of 3 or more. The plate type particles have an average particle diameter of 1 to 200 mum. The plate type particles are plate type particles formed of at least one material selected from the group consisting of mica, talc, and glass flakes. The mica is mica calcined at 800 deg.C or more, and the talc is talc calcined at 900 deg.C or more. The bonding material layer has a porosity of less than 50%. The objects to be joined are honeycomb segments(2).
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