发明名称 PLASMA PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma processing apparatus capable of effectively removing particles accumulated in an edge area of the upper surface, a side, an edge area of the lower surface, and the central portion on the lower surface of a substrate. SOLUTION: A plasma processing apparatus includes: a chamber; an insulating member disposed in an upper portion of the chamber; a ground electrode formed at a side wall of the chamber, a ground potential being applied to the ground electrode; and a lower electrode disposed in a lower portion of the chamber, a substrate being placed on the lower electrode, wherein the lower electrode is divided into a plurality of electrodes. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008147650(A) 申请公布日期 2008.06.26
申请号 JP20070308337 申请日期 2007.11.29
申请人 TES CO LTD 发明人 KIM SUNG RYUL
分类号 H01L21/3065 主分类号 H01L21/3065
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