| 摘要 |
A microelectronic package includes a substrate ( 110, 210, 310, 410, 510, 731 ), a die ( 120, 220, 320, 420, 520, 732 ), and a heat spreading region ( 130, 230, 330, 430, 530, 733 ). The die, which has an active side ( 121, 221, 321, 421, 521 ) and a passive side ( 122, 222, 322, 422, 522 ) located opposite the active side, is located over the substrate, and the heat spreading region is adjacent to the passive side of the die. The heat spreading region includes a composite ( 135, 235, 335, 435, 535 ) of nanotubes and a thermally conducting material.
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