发明名称 |
MEMS DEVICE AND INTERCONNECTS FOR SAME |
摘要 |
A microelectromechanical systems device having an electrical interconnect connected to at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a movable layer of the device. A thin film, particularly formed of molybdenum, is provided underneath the electrical interconnect. The movable layer preferably comprises aluminum.
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申请公布号 |
US2008151352(A1) |
申请公布日期 |
2008.06.26 |
申请号 |
US20060613922 |
申请日期 |
2006.12.20 |
申请人 |
QUALCOMM MEMS TECHNOLOGIES, INC. |
发明人 |
CHUNG WONSUK;GANTI SURYAPRAKASH;ZEE STEPHEN |
分类号 |
G02B26/00;H01B13/00 |
主分类号 |
G02B26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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