发明名称 Light emitting diode with thermal spreading layer
摘要 A light emitting diode and the method of the same are provided. The light emitting diode includes a substrate, a thermal spreading layer, a connecting layer and an epitaxial structure. The substrate is selected from a transparent substrate or a non-transparent substrate, which corresponds to different materials of the connecting layers respectively. The thermal spreading layer, configured to improve the thermal conduction of the light emitting diode, is selected from diamond, impurity-doped diamond or diamond-like materials.
申请公布号 US7391061(B2) 申请公布日期 2008.06.24
申请号 US20050316461 申请日期 2005.12.22
申请人 EPISTAR CORPORATION 发明人 SHIEH YUH-REN;WU JEN-CHAU;TU CHUAN-CHENG
分类号 H01L23/373;H01L33/00;H01L33/38;H01L33/64 主分类号 H01L23/373
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