| 摘要 |
A fixing device using an air current flow is provided to prevent a sticking phenomenon between a wafer and a wafer fixing portion by fixing the wafer in a contactless manner. A fixing portion(30) includes a first flow path(60) and plural second flow paths(70). The first flow path is penetrated upwards. The second flow path is connected to one end of the first flow path and slantingly penetrates an upper portion of the fixing portion. An inner diameter of the first flow path is greater than a sum of inner diameters of the second flow paths. An air supply portion(50) is connected to one end of the first flow path, such that the air sprayed from the upper portion of the fixing portion is maintained at a pressure lower than an ambient pressure. The air supply portion is connected to one end of the first flow path. A flow rate adjusting valve(40) is connected to the air supply portion and adjusts a flow rate of the air. The air flow sprayed from one of the second flow paths is overlapped with the air flow sprayed from an upper end of the second flow path. The second flow path is formed in a spiral shape.
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