| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a pick-up apparatus capable of surely picking up a semiconductor chip from an adhesive sheet without damage. <P>SOLUTION: The pick-up apparatus includes a backup body 1 having an upper surface sucking and holding a lower surface of the adhesive sheet 3, a push-up body provided to be capable of driving up and down in the backup body for pressing the lower surface of the adhesive sheet to push up the semiconductor chip 4 and having a push-up area for pressing the semiconductor chip gradually decreasing as it pushes up, a pick-up means 11 having a suction nozzle 17 for sucking and holding an upper surface of the semiconductor chip for sucking the semiconductor chip pushed up by the push-up body and picking up from the adhesive sheet, and a linear actuator 18 for driving the suction nozzle when picking up the semiconductor chip to apply pressing force for preventing the chip from bending to deform downward by tension of the adhesive sheet. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
