| 发明名称 |
CERAMIC PACKAGE SUBSTRATE WITH RECESSED DEVICE |
| 摘要 |
A ceramic package substrate has a recess. This allows a device in that recess to be close to a die attached to the substrate's top side, for better performance. The device may be an array capacitor, an in-silicon voltage regulator, or another device or devices.
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| 申请公布号 |
US2008142961(A1) |
申请公布日期 |
2008.06.19 |
| 申请号 |
US20060611063 |
申请日期 |
2006.12.14 |
| 申请人 |
JONES CHRISTOPHER C;BACH DAVID;LITT TIMOTHE;BINDER LARRY;RADHAKRISHNAN KALADHAR;PALANDUZ CENGIZ A |
发明人 |
JONES CHRISTOPHER C.;BACH DAVID;LITT TIMOTHE;BINDER LARRY;RADHAKRISHNAN KALADHAR;PALANDUZ CENGIZ A. |
| 分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
| 代理机构 |
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代理人 |
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