Component Provided With A Set Of Hard Conducting Microttips And Process For Making An Electrical Connection Between This Component And A Component Proviced With Ductile Conducting Bumps

摘要

This invention relates to a process for making an electrical connection between a first component ( 10 ) comprising a set of first pads ( 8 ) and a set of hard conducting tips ( 13 ) on one face, and a second component ( 11 ) comprising a set of second pads ( 9 ) and a set of ductile conducting bumps ( 14 ) on the other face, in which the two faces are made to face each other and they are brought towards each other such that the tips ( 13 ) can penetrate into these bumps ( 14 ), in which the space between two tips ( 13 ) is less than the width of a bump ( 14 ) and less than the width of a first pad ( 8 ). The invention also relates to such a component on which such a set of conducting tips is installed.