| 摘要 |
A contact pin ( 50 ) for contacting a terminal of a wafer and supplying a signal to that wafer is provided with a first conductive layer ( 51 b) composed of a first conductive material having a relatively higher hardness than the oxide film formed on the terminal of the wafer, a second conductive layer ( 51 c) composed of a second conductive material having a relatively lower hardness than the oxide film, and a base material ( 51 a) with the first conductive layer ( 51 b) and second conductive layer ( 51 c) formed at the outside, the first conductive layer ( 51 b) being formed so as to closely contact the outside of the second conductive layer ( 51 c), the first conductive layer ( 51 b) and second conductive layer ( 51 c) both being exposed at the front end face ( 50 a) of the contact pin ( 50 ).
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