发明名称 METHOD OF FABRICATING A NITRIDED SILICON OXIDE GATE DIELECTRIC LAYER
摘要 A method of forming a nitrided silicon oxide layer. The method includes: forming a silicon dioxide layer on a surface (32) of a silicon substrate (30); performing a rapid thermal nitridation of the silicon dioxide layer at a temperature of less than or equal to about 900 °C and a pressure greater than about 500 Torr to form an initial nitrided silicon oxide layer; and performing a rapid thermal oxidation or anneal of the initial nitrided silicon oxide layer at a temperature of less than or equal to about 900 °C and a pressure greater than about 500 Torr to form a nitrided silicon oxide layer (34). Also a method of forming a MOSFET with a nitrided silicon oxide dielectric layer (34).
申请公布号 WO2008055150(A3) 申请公布日期 2008.06.19
申请号 WO2007US82988 申请日期 2007.10.30
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;ADAMS, EDWARD, DENNIS;BURNHAM, JAY, SANFORD;GOUSEV, EVGENI;NAKOS, JAMES, SPIROS;PREUSS, HEATHER, ELIZABETH;SHEPARD, JOSEPH, FRANCIS 发明人 ADAMS, EDWARD, DENNIS;BURNHAM, JAY, SANFORD;GOUSEV, EVGENI;NAKOS, JAMES, SPIROS;PREUSS, HEATHER, ELIZABETH;SHEPARD, JOSEPH, FRANCIS
分类号 H01L21/31 主分类号 H01L21/31
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