| 摘要 |
The invention relates to a method for producing a thin layer (104) on a final substrate (107) consisting in forming said semiconductor layer on an initial carrier (101), assembling said thin layer (104) and the final substrate (107) by metallic bonding, and in mechanically separating the initial carrier and the thin layer (107), thereby obtaining an intermediate substrate usable for producing different components such as electroluminescent diodes or laser diodes. The inventive method makes it possible to produce a thin layer on a final substrate from an initial substrate which is recyclable by non- destructive mechanical dismounting. |
