METHOD OF MAKING THERMALLY ENHANCED SUBSTRATE-BASED ARRAY PACKAGE
摘要
An array-type package (10) encasing one or more semiconductor devices (30). The package (10) includes a dielectric substrate (12) having opposing first (14) and second (16) sides with a plurality of electrically conductive vias (18) and a centrally disposed aperture (20) extending from the first side (14) to the second side (16). A heat slug (22) has a mid portion (28) extending through the aperture (20), a first portion (24) adjacent the first side (14) of the substrate (12) with a cross sectional area larger than the cross sectional area of the aperture (20) and an opposing second portion (26) adjacent the second side (16) of the substrate (12). One or more semiconductor devices (30) are bonded to the first portion (24) of the heat slug (22) and electrically interconnected (32) to the electrically conductive vias (18). A heat spreader (34) having a first side (36) and an opposing second side (38) is spaced from the semiconductor devices (30) and generally parallel with the heat slug (22), whereby the semiconductor devices (30) are disposed between the heat spreader (34) and the heat slug (22). A molding resin (40) encapsulates the semiconductor devices (30) and at least the first side (14) of the substrate (12), the first portion (24) of the heat slug (22) and the first side (36) of the heat spreader (34).
申请公布号
WO2007145925(B1)
申请公布日期
2008.06.12
申请号
WO2007US13206
申请日期
2007.06.05
申请人
ADVANCED INTERCONNECT TECHNOLOGIES LIMITED;ADVANCED INTERCONNECT TECHNOLOGIES, INC.
发明人
LEUNG, TIMOTHY;RAMOS, MARY JEAN, BAJACAN;YEOW, GAN KIAN;LWIN, KYAW KO;SAN ANTONIO, ROMARICO SANTOS;SUBAGIO, ANANG