发明名称 |
Interconnecting Board and Three-Dimensional Wiring Structure Using it |
摘要 |
A first circuit board ( 1 ) mounted with an electronic component ( 16 ) and a second circuit board ( 2 ) are vertically connected three-dimensionally through an interconnecting board ( 3 ) wherein the terminal portion ( 6 ) of the land electrode ( 5 ) on the interconnecting board ( 3 ) is buried in the termination material ( 9 ) of the interconnecting board ( 3 ). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.
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申请公布号 |
US2008139013(A1) |
申请公布日期 |
2008.06.12 |
申请号 |
US20060995339 |
申请日期 |
2006.04.17 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TOMURA YOSHIHIRO;NAKAGIRI YASUSHI;HIBINO KUNIO;YAGI YOSHIHIKO;MIYASHITA AKIHIRO;ONO MASAHIRO;MORI MASATO |
分类号 |
H01R12/00;H01R43/00 |
主分类号 |
H01R12/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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