OXETANE-CONTAINING RESIN, AND ADHESIVE AGENT AND RESIST AGENT EACH USING THE SAME

摘要

[PROBLEMS] To provide: a thermosetting resin which can be used in the production of a laminate for use in an destiné à être employé dans un component, an electrical product or a fiber, particularly can be used in a multilayer circuit board or a flat cable, which can be suitably used in a latently thermosettable adhesive agent that exhibits the level of fluidability required for adhesion when being adhered but can be cured rapidly by exposure to heat or light, and which has excellent solder heat resistance; a resin which can exhibit excellent flame retardancy without using any halogen, and which has a latent curable property and therefore can be cured rapidly by exposure to heat or light; and an adhesive agent and a resist agent each comprising the resin. [MEANS FOR SOLVING PROBLEMS] Disclosed are: an oxetane-containing resin which has a number average molecular weight of 2000 or greater, has at least one linkage group selected from an ester bond, an urethane bond, an amide bond and an ether bond in the main chain, has 100 to 10000 equivalents/ton of an oxetane group in the molecule, and also has 300 to 5000 equivalents/ton of a carboxyl group, 0.1% by weight of a phosphorus atom or 100 to 2000 equivalents/ton of an ethylenically unsaturated double bond in the molecule; and an adhesive agent and a resist agent each comprising the resin.