发明名称 HEAT DISSIPATION MODULE
摘要 A heat dissipation module including a housing, a fan module, a cooling fin set, and a heat pipe is provided. The housing has a fan accommodation area, a first heat dissipation area, a second heat dissipation area, and a heat conducting area. The fan module is disposed in the fan accommodation area, and the cooling fin set is disposed in the first heat dissipation area. The heat pipe has a heat absorbing portion, a curved portion, and a heat dissipation portion, and the curved portion connects the heat absorbing portion and the heat dissipation portion. The curved portion is in thermal contact with the second dissipation area, and the heat dissipation portion is in thermal contact with the cooling fin set. Thus, the efficiency of heat dissipation of the heat pipe is improved.
申请公布号 US2008135210(A1) 申请公布日期 2008.06.12
申请号 US20070675844 申请日期 2007.02.16
申请人 INVENTEC CORPORATION 发明人 WANG FRANK;YANG CHIH-KAI
分类号 F28F1/00;H05K7/20 主分类号 F28F1/00
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