发明名称 |
THREE-DIMENSIONAL PACKAGING SCHEME FOR PACKAGE TYPES UTILIZING A SACRIFICAIL METAL BASE |
摘要 |
An apparatus and a method for packaging semi-conductor devices. The apparatus is applicable to many types of contemporary packaging schemes that utilize a sacrificial metal base strip. Tunnels (213) formed through an encapsulation area (215) surrounding the device (207) and associated bond wires (211) are filled with a metallic conductor by, for example, electroplating, and extend bottom contact pads (205) to an uppermost portion of the encapsulated area (215) . The sacrificial metal base strip (201) serves as a plating bus and is etch-removed after plating. The filled tunnels (213) allow components to be stacked in a three-dimensional configuration. |
申请公布号 |
WO2007127739(A3) |
申请公布日期 |
2008.06.12 |
申请号 |
WO2007US67315 |
申请日期 |
2007.04.24 |
申请人 |
ATMEL CORPORATION;LAM, KEN, M. |
发明人 |
LAM, KEN, M. |
分类号 |
H01L23/02;H01L21/44;H01L21/48;H01L21/50;H01L23/04;H01L23/40;H01L23/48 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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