摘要 |
Semiconductor element having a semiconductor chip and a passive component, as well as a method for its production The invention relates to a semiconductor component ( 1 ) having a semiconductor chip ( 2 ), and a passive component ( 3 ), with the semiconductor component ( 1 ) having a coil ( 6 ) as the passive component ( 3 ). The semiconductor chip ( 2 ) and the passive component ( 3 ) are embedded in a plastic encapsulation compound ( 4 ) with connection elements to external contacts ( 31 ).
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