发明名称 Semiconductor component including a semiconductor chip and a passive component
摘要 Semiconductor element having a semiconductor chip and a passive component, as well as a method for its production The invention relates to a semiconductor component ( 1 ) having a semiconductor chip ( 2 ), and a passive component ( 3 ), with the semiconductor component ( 1 ) having a coil ( 6 ) as the passive component ( 3 ). The semiconductor chip ( 2 ) and the passive component ( 3 ) are embedded in a plastic encapsulation compound ( 4 ) with connection elements to external contacts ( 31 ).
申请公布号 US2008135977(A1) 申请公布日期 2008.06.12
申请号 US20060614579 申请日期 2006.12.21
申请人 INFINEON TECHNOLOGIES AG 发明人 MEYER THORSTEN;WAIDHAS BERND;BRUNNBAUER MARKUS;SOMMER GRIT;WAGNER THOMAS
分类号 H01L21/20;H01L29/00 主分类号 H01L21/20
代理机构 代理人
主权项
地址