发明名称 PRODUCTION OF PLASTIC SEAL TYPE ELECTRONIC DEVICE
摘要 <p>PURPOSE:To prevent the effluence of resin between leads by providing raised parts in the portions where resin is to be filled, blanking at least a part of the raised parts of the leads, and injecting the resin into the molds in the condition wherein the self-aligned upper and lower mods are installed between each lead thus molding the electronic device.</p>
申请公布号 JPS52144966(A) 申请公布日期 1977.12.02
申请号 JP19760061135 申请日期 1976.05.28
申请人 HITACHI LTD 发明人 IBA TOSHIROU;WATANABE TAKEFUMI
分类号 H01L23/48;H01L21/56;H01L23/02;H01L23/12 主分类号 H01L23/48
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