发明名称 |
PRODUCTION OF PLASTIC SEAL TYPE ELECTRONIC DEVICE |
摘要 |
<p>PURPOSE:To prevent the effluence of resin between leads by providing raised parts in the portions where resin is to be filled, blanking at least a part of the raised parts of the leads, and injecting the resin into the molds in the condition wherein the self-aligned upper and lower mods are installed between each lead thus molding the electronic device.</p> |
申请公布号 |
JPS52144966(A) |
申请公布日期 |
1977.12.02 |
申请号 |
JP19760061135 |
申请日期 |
1976.05.28 |
申请人 |
HITACHI LTD |
发明人 |
IBA TOSHIROU;WATANABE TAKEFUMI |
分类号 |
H01L23/48;H01L21/56;H01L23/02;H01L23/12 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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