| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors, which is excellent in flowability when molded, mold releasability, continuous moldability, low moisture absorbability and low stress property of a cured resin, and balance of adhesive force to metal-based members, and gives semiconductor devices excellent in solder reflow resistance. <P>SOLUTION: This epoxy resin composition for sealing the semiconductors, comprising (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) a curing accelerator, (D) an inorganic filler, (E) (E-1) a trimethylolpropane trifatty acid ester, and/or (E-2) a composite full ester of trimethylolpropane with a fatty acid and a dicarboxylic acid is characterized in that (A) the epoxy resin comprises at least one epoxy resin selected from (A-1) a phenol aralkyl type epoxy resin or naphthol aralkyl type epoxy resin which have a phenylene skeleton, a biphenylene skeleton or a naphthylene skeleton, (A-2) a biphenyl type epoxy resin, and (A-3) a bisphenol type epoxy resin, or (B) the phenolic resin-based curing agent comprises (B-1) a phenol aralkyl resin or a naphthol aralkyl resin which have a phenylene skeleton, a biphenylene skeleton or a naphthylene skeleton. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
