| 摘要 |
A bonding material composition is provided to relieve thermal stress generated in a joined body even without using expensive and harmful fiber, and to reduce defects such as cracks or voids generated upon drying or heat treatment. A bonding material composition for putting at least two objects(11) together through a bonding material layer(9) to obtain a joined body, includes plate-like particles, non-plate like particles, smectite-based clay, and an inorganic adhesive. A ratio of the plate-like particles contained in the bonding material composition is 12-38% by mass based on the amount of the main components. A ratio of the smectite-based clay contained in the bonding material composition is 0.1-5% by mass based on the total amount of the main components. |
