| 摘要 |
A dicing adhesive film and a semiconductor package using the same are provided to improve an inter-chip insulation property by effectively covering a wire using a liquid paste. A capsule type dicing adhesive film includes a first solid layer, a liquid layer(B), and a second solid layer, which are sequentially laminated on one another. During a die attaching process, the second solid layer, which supports the liquid layer, is exploded due to an external temperature, and an adhesive agent is leaked from the liquid layer. The adhesive agent covers a lower die of the second solid layer and a wire, which electrically couples the lower die of the second solid layer with a substrate. An adhesive property of the first solid layer is greater than 20 gf/cm. The liquid layer is cured by the heat from a laser beam and a frictional heat between a wafer and a blade. |
