| 发明名称 |
ELECTROPLATING METHOD FOR A SEMICONDUCTOR DEVICE |
| 摘要 |
An electroplating method calls for immersing a body to be plated in a plating solution containing tin and bismuth to form a tin-bismuth alloy skin layer on surfaces of the body. The plating is carried out such that a solid tin metal and a solid bismuth metal placed in the plating solution are connected to an anode and the body to be plated is connected to a cathode of a power supply.
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| 申请公布号 |
US2008132005(A1) |
申请公布日期 |
2008.06.05 |
| 申请号 |
US20080015545 |
申请日期 |
2008.01.17 |
| 申请人 |
KINOSHITA MITSURU;HIRANO TSUGIHIKO;TAKAHASHI KATSUNORI |
发明人 |
KINOSHITA MITSURU;HIRANO TSUGIHIKO;TAKAHASHI KATSUNORI |
| 分类号 |
C25D7/12;H01L21/56;C25D3/56;C25D17/10;C25D17/12;H01L21/50;H01L21/60;H01L23/31;H01L23/495;H01L23/50 |
主分类号 |
C25D7/12 |
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