| 摘要 |
According to the present invention, when performing spin treatment on a square wafer for a solar battery, it is possible to prevent the treatment medium, which is caused to flow down onto the surface of the wafer and scattered to the outside of the wafer from the four sides thereof in droplets, from reaching the back surface of the wafer. A surface treating apparatus for a square wafer for a solar battery according to the present invention includes: a rotating disc capable of rotating at a predetermined speed; a wafer holding part protruding from the central portion of the upper surface of the rotating disc and adapted to hold a square wafer; a flow-down nozzle for supplying the treatment medium onto a surface of the square wafer from above the wafer holding part in a downflow; and four correction plates provided upright on the rotating disc so as to be situated outward respectively in correspondence with the four sides of the square wafer when the square wafer is held by the wafer holding part; when, with the square wafer being held by the wafer holding part, the rotating disc is rotated and the treatment medium is caused to flow down onto the surface of the square wafer, it is possible to prevent the treatment medium from reaching the back surface of the square wafer.
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