发明名称 EJECTOR STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a package having a substrate in which the electronic circuit is prepared, and an ejector main body which is prepared in one end part side of the substrate: comprises a conductive front panel; is prepared in the package inserted to and extracted from the shelf; and is rotatably provided at the front panel, when one rotating end part side of the ejector main body is rotated in one direction, in the state that the package is inserted into the shelf, the shelf is pushed by the other rotating end part side, a force in the direction for slipping out the shelf is worked in the ejector structure, the operation is easy, the static electricity is removed reliably, and further, the generation of metal powder is lessened. SOLUTION: The ejector main body 7 has a conductive metal fitting 17 which is connected to the front panel 6 electrically, and capable of coming into contact with the shelf, in the state that the package 1 is inserted into the shelf, and a first energizing means which energizes the metal fitting 17 in the direction to be brought into contact with the shelf. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008130965(A) 申请公布日期 2008.06.05
申请号 JP20060316899 申请日期 2006.11.24
申请人 FUJITSU LTD 发明人 ABE HAYAMIZU;OSADA AKITO;KOTAKA SATOSHI;HASEGAWA YUJI;NAKAMURA HIROSHI
分类号 H05K7/14 主分类号 H05K7/14
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