ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

摘要

An electronic component mounting structure (1) connects an electronic component (10) having a plurality of electrode terminals (10a) and a mounting substrate (12) having a connecting terminal (12a) at a position facing the electrode terminals (10a). The structure connects the electrode terminals (10a) and the connecting terminal (12a) through a protruding electrode (13) arranged on the electrode terminals (10a) or the connecting terminal (12a). The protruding electrode (13) includes at least a conductive filler (13a) and a photosensitive resin (13b), and the resin composition crosslink densities of the photosensitive resin (13b) vary in the height direction of the protruding electrode (13).