发明名称 Method and apparatus for vapour phase soldering
摘要 The present invention concerns a method and an apparatus for performing soldering of items that are applied a soldering agent, where the soldering apparatus includes at least one soldering zone, where the soldering zone include means for generating vapor, the apparatus being adapted to heat the items to be soldered to a temperature required for soldering by condensing the vapor. Further the invention relates to a method and an apparatus for flux deposition connected to a soldering machine, which soldering machine comprises a solder heating medium evaporated by heating means forming a vapor that heats elements to be soldered by heat transfer and by condensation, which apparatus comprises means for condensation, of a vapor containing flux where pumping means circulate vapor containing flux through the condensation means, where the condensation means comprises heat exchangers for cooling the vapor for flux condensation.
申请公布号 US7380699(B2) 申请公布日期 2008.06.03
申请号 US20040517815 申请日期 2004.12.14
申请人 VAPOUR PHASE TECHNOLOGY APS 发明人 DOKKEDAHL LARS
分类号 B23K31/00;B23K1/015;B23K37/00 主分类号 B23K31/00
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