| 摘要 |
A method of sealing an Organic Light-Emitting Diode (OLED) assembly is disclosed. According to the method, a liquid adhesive is applied to substantially all of a surface of an OLED assembly. A region of increased thickness of liquid adhesive is formed adjacent to a first edge of the OLED assembly. A first edge of the protective cover is placed adjacent to the first edge of the OLED assembly. A second edge of the protective cover is moved toward a second edge of the OLED assembly such that the region of increased thickness of liquid adhesive is moved from being adjacent to the first edge of the OLED assembly to being adjacent to the second edge of the OLED assembly. The liquid adhesive is allowed to stabilize and is then cured.
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