SUBSTRATE SUPPORT UNIT, AND APPARATUS AND METHOD FOR TREATING SUBSTRATE WITH THE SAME

摘要

A substrate support unit, and a substrate treatment apparatus including the same and a method thereof are provided to treat a face opposite to a chuck plate by proceeding a process with the chuck plate being spaced apart from a substrate. A substrate support unit includes a chuck plate and a gas supply member. A plurality of vortex generating holes are disposed annularly with respect to the center of the chuck plate in the chuck plate. The gas supply member includes injection lines(248) supplying gas in a direction tangential to the inner surfaces of the vortex generating holes so that the gas turns along the inner surfaces of the vortex generating holes. The gas supply member is formed in the chuck plate. The gas supply member supplies the gas into the vortex generating holes through the injection lines. The injection lines include an inner line connecting the center of the chuck plate to the shortest points.