发明名称 |
DIE PAD FOR SEMICONDUCTOR PACKAGES |
摘要 |
A semiconductor device package (10) includes a semiconductor device (20) and an electrically conductive lead frame (22) at least partially covered by a molding compound (18). The electrically conductive lead frame (22) includes a plurality of leads (23) disposed proximate a perimeter of the package (10) and a die pad (30) disposed in a central region formed by the plurality of leads (23). The semiconductor device (20) is attached to the die pad (30), and a portion of the die pad (30) extending outward from the die (20) is roughened to improve adhesion to the molding compound (18). In other aspects, grooves (50, 52) are disposed in die pad (30) surfaces to further promote adhesion of the die pad (30) and to prevent moisture from permeating into the vicinity of the semiconductor chip (20). |
申请公布号 |
KR20080048526(A) |
申请公布日期 |
2008.06.02 |
申请号 |
KR20087008238 |
申请日期 |
2008.04.04 |
申请人 |
UNISEM (MAURITIUS) HOLDINGS LIMITED |
发明人 |
ISLAM SHAFIDUL;SAN ANTONIO ROMARICO SANTOS;SUBAGIO ANANG |
分类号 |
H01L23/495;H01L23/10;H01L23/34;H01L23/52 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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