发明名称 |
Multi-layer polymer solder hybrid thermal interface material for integrated heat spreader and methodof making same |
摘要 |
A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an integrated heat spreader and a die. Processing of the multi-layer thermal interface material includes stamping or other pressure processing. |
申请公布号 |
HK1083390(A1) |
申请公布日期 |
2008.05.30 |
申请号 |
HK20060104650 |
申请日期 |
2006.04.19 |
申请人 |
INTEL CORPORATION |
发明人 |
SABINA HOULE;ASHAY DANI |
分类号 |
H01L;B23K1/00;B23K35/14;H01L23/373;H01L23/433 |
主分类号 |
H01L |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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