发明名称 Multi-layer polymer solder hybrid thermal interface material for integrated heat spreader and methodof making same
摘要 A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an integrated heat spreader and a die. Processing of the multi-layer thermal interface material includes stamping or other pressure processing.
申请公布号 HK1083390(A1) 申请公布日期 2008.05.30
申请号 HK20060104650 申请日期 2006.04.19
申请人 INTEL CORPORATION 发明人 SABINA HOULE;ASHAY DANI
分类号 H01L;B23K1/00;B23K35/14;H01L23/373;H01L23/433 主分类号 H01L
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