| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer wiring board, capable of reducing cost increase. <P>SOLUTION: The multilayer wiring board includes a plurality of wiring layers P1-P3 which are laminated. The manufacturing method has a step of individually forming the wiring layers P1-P3; a step of inspecting each of the formed wiring layers P1-P3; and a step of selecting the wiring layers P1-P3 depending on a result of inspection of the wiring layers P1-P3, and bonding each of the selected wiring layers. The manufacturing method also has a step of applying liquid drops containing an adhesive to the wiring layers, a step of bringing the liquid droplets containing the applied adhesive into a semi-curing state, and a step of bonding the wiring layers P1-P3 using the semi-cured adhesive. <P>COPYRIGHT: (C)2008,JPO&INPIT |
