发明名称 HEAT PIPE, HEAT PIPE MODULE AND HEAT PIPE MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a lightweight heat pipe for a large amount of heat transportation and to reduce the manufacturing cost of the heat pipe by a simple method of manufacturing the heat pipe. <P>SOLUTION: The heat pipe 1 is formed by forming the external wall side of hollow glass as a dense glass layer 2 formed of dense glass, forms pores 4 on the internal wall side of the hollow glass, and also forms both end parts of the hollow glass as porous glass layers 3 communicating through the pores 4. Material forming particularly the hollow glass may be SiO<SB>2</SB>-B<SB>2</SB>O<SB>3</SB>-Na<SB>2</SB>O based glass. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008122024(A) 申请公布日期 2008.05.29
申请号 JP20060308535 申请日期 2006.11.15
申请人 SUMITOMO ELECTRIC IND LTD 发明人 KAWAI CHIHIRO
分类号 F28D15/02;H01L23/427;H05K7/20 主分类号 F28D15/02
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