SUPPORT PIN POSITIONING APPARATUS, SUPPORT PIN POSITIONING METHOD, AND COMPONENT MOUNTING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a support pin positioning apparatus which prevents the warpage of a substrate caused by its weight, and the warpage of the substrate caused by the press of an electronic component when the component is mounted on the surface of the substrate.

SOLUTION: The substrate information of the second mounting plane of the substrate 20 is loaded from a database 607 to an processing unit 601 (S28). A support pin positioning data 616 display a pin hole 504, a basic hole 514, and the component of the second mounting plane overlapped each other (S30). The layout of the position of the pin hole 504 is possible to be placed under the component of the second mounting plane by displaying the component of the second mounting plane overlapped (S32). For this layout, the component mounting position is supported by the supporting pin 510 so that the substrate 20 is prevented form the warpage when the component is mounted.

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