| 摘要 |
PROBLEM TO BE SOLVED: To provide a micromachining treatment agent for selectively micromachining only a silicon compound containing film when a laminated film with a silicon compound containing film and a polysilicon film or an amorphous silicon film being is micromachined, and to provide a micromachining treatment method using it. SOLUTION: This micromachining treatment agent is formed by adding 0.001-0.1 wt.% of a surfactant of at least either of aliphatic amine or aliphatic aminohydrofluoride to a mixed solution containing 0.05-10 wt.% of hydrogen fluoride, 10-39 wt.% of ammonium fluoride and water. When the content of hydrogen fluoride is X wt.% and the content of ammonium fluoride is Y wt.%, X and Y satisfy the following mathematical expression: The selection ratio for etching rates of the silicon compound containing film and the polysilicon film or the amorphous silicon film (silicon compound containing film/(polysilicon film or amorphous silicon film)) is≥1,000. COPYRIGHT: (C)2008,JPO&INPIT
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